Circuit Documentation

Summary

This document provides a detailed overview of a circuit that integrates various sensors and modules with a NodeMCU V3 ESP8266 microcontroller. The circuit includes a GPS module, a vibration sensor, an accelerometer, a gyroscope, a GSM module, and a battery management system. The NodeMCU V3 ESP8266 serves as the central controller, interfacing with all the sensors and modules to collect data and perform necessary operations.

Component List

1. NodeMCU V3 ESP8266

   • Description: A low-cost Wi-Fi microcontroller with multiple GPIO pins.
   • Pins: A0, GND, VU, S3, S2, S1, SC, S0, SK, 3V3, EN, RST, Vin, D0, D1, D2, D3, D4, D5, D6, D7, D8, RX, TX

2. GPS NEO 6M

   • Description: A GPS module used for location tracking.
   • Pins: VCC, RX, TX, GND

3. TP4056

   • Description: A lithium battery charger module.
   • Pins: OUT-, B-, B+, OUT+, IN-, IN+

4. Sim800l

   • Description: A GSM module for cellular communication.
   • Pins: NET, RST, VCC, RXD, TXD, GND

5. MPU-6050

   • Description: A 6-axis motion tracking device combining a gyroscope and accelerometer.
   • Pins: VCC, GND, SCL, SDA, XDA, XCL, AD0, INT

6. AITrip ADXL335 GY-61

   • Description: A 3-axis accelerometer.
   • Pins: GND, Z-Out, Y-Out, X-Out, VCC

7. SW-420 Vibration Sensor

   • Description: A vibration sensor module.
   • Pins: vcc, Ground, Digital output

8. Li-ion battery 18650-2000mAh 3.7V 7.4WH

   • Description: A rechargeable lithium-ion battery.
   • Pins: +, -

9. Electrolytic Capacitor

   • Description: A capacitor used for filtering and stabilization.
   • Pins: -, +
   • Properties: Capacitance: 0.000001 Farads

Wiring Details

NodeMCU V3 ESP8266

• A0 connected to X-Out of AITrip ADXL335 GY-61
• GND connected to:
  • - of Electrolytic Capacitor
  • OUT- of TP4056
  • GND of MPU-6050
  • GND of GPS NEO 6M
  • Ground of SW-420 Vibration Sensor
  • GND of AITrip ADXL335 GY-61
  • GND of Sim800l
• Vin connected to:
  • + of Electrolytic Capacitor
  • OUT+ of TP4056
• D1 connected to SDA of MPU-6050
• D2 connected to SCL of MPU-6050
• D3 connected to TX of GPS NEO 6M
• D4 connected to Digital output of SW-420 Vibration Sensor
• 3V3 connected to:
  • VCC of MPU-6050
  • VCC of GPS NEO 6M
  • vcc of SW-420 Vibration Sensor
  • VCC of AITrip ADXL335 GY-61
  • VCC of Sim800l
• D6 connected to RXD of Sim800l
• D7 connected to TXD of Sim800l

GPS NEO 6M

• VCC connected to 3V3 of NodeMCU V3 ESP8266
• RX not connected
• TX connected to D3 of NodeMCU V3 ESP8266
• GND connected to GND of NodeMCU V3 ESP8266

TP4056

• OUT- connected to GND of NodeMCU V3 ESP8266
• B- connected to - of Li-ion battery 18650-2000mAh 3.7V 7.4WH
• B+ connected to + of Li-ion battery 18650-2000mAh 3.7V 7.4WH
• OUT+ connected to Vin of NodeMCU V3 ESP8266
• IN- not connected
• IN+ not connected

Sim800l

• NET not connected
• RST not connected
• VCC connected to 3V3 of NodeMCU V3 ESP8266
• RXD connected to D6 of NodeMCU V3 ESP8266
• TXD connected to D7 of NodeMCU V3 ESP8266
• GND connected to GND of NodeMCU V3 ESP8266

MPU-6050

• VCC connected to 3V3 of NodeMCU V3 ESP8266
• GND connected to GND of NodeMCU V3 ESP8266
• SCL connected to D2 of NodeMCU V3 ESP8266
• SDA connected to D1 of NodeMCU V3 ESP8266
• XDA not connected
• XCL not connected
• AD0 not connected
• INT not connected

AITrip ADXL335 GY-61

• GND connected to GND of NodeMCU V3 ESP8266
• Z-Out not connected
• Y-Out not connected
• X-Out connected to A0 of NodeMCU V3 ESP8266
• VCC connected to 3V3 of NodeMCU V3 ESP8266

SW-420 Vibration Sensor

• vcc connected to 3V3 of NodeMCU V3 ESP8266
• Ground connected to GND of NodeMCU V3 ESP8266
• Digital output connected to D4 of NodeMCU V3 ESP8266

Li-ion battery 18650-2000mAh 3.7V 7.4WH

• - connected to B- of TP4056
• + connected to B+ of TP4056

Electrolytic Capacitor

• - connected to GND of NodeMCU V3 ESP8266
• + connected to Vin of NodeMCU V3 ESP8266

Code

No code is provided for this circuit.

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This document provides a comprehensive overview of the circuit, including a summary, component list, wiring details, and code section. Each component is described, and its connections are detailed to ensure proper assembly and functionality.